April 2014

Delong America attending TechConnect World Innovation Conference & Expo (Booth 405)

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Delong America is pleased to announce that we will be at booth 405 at the 2014 TechConnect World Innovation Conference & Expo meeting in Washington, DC. The exhibits will be open June 16-17.

The TechConnect World is the world’s largest multi-disciplinary multi-sector conference and marketplace of vetted innovations, innovators and technology business developers and funders. The TechConnect World houses four world-class technical events focused on advancements in Nanotech, Microtech, Biotech, Cleantech and the technology overlap between these converging domains. TechConnect World, co-located with the National SBIR Conference and the National Innovation Summit, delivers the world’s largest gathering of commercialization-focused innovators from Federal Agencies, Federal & Academic Labs, Corporate Tech Developers, and Start-up & SBIR Companies.

The LVEM5 is the only multi-modal desktop EM on the market. It is able to operate in transmission modes as a TEM and in scanning modes as a SEM or STEM. Users are able to obtain all three types of information from the same sample and even the same area of interest. The LVEM5 is also capable of preforming electron diffraction.

The LVEM5 is capable of 1.2nm resolution in TEM mode and 3nm resolution in SEM mode, so you can see even your smallest of particles

The LVEM5 benefits from a 5kv electron source that means that you can visualize light weight materials such as polymers or biological tissues without the need for heavy metal stains. This is a huge advantage for users who want to get a greater understanding of their materials, and not their stain.

We are looking forward to meeting with you at the conference.


Materials Science & Technology 2013
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